부스번호 : C137
| 회사명 | 한미반도체 | HANMI Semiconductor |
|---|---|
| 국 가 | Rep. of Korea |
| 주 소 | 인천광역시 서해구 가좌로12번길 15, 한미반도체 | 15, Gajwa-ro 12 beon-gil, Seohae-gu, Incheon, South Korea |
| 전 화 | 82-32-571-9100 |
| 팩 스 | 82-32-571-9101 |
| URL | www.hanmisemi.com |
| - | |
| 주요 전시품목 | 반도체 장비 |
| 출품품목 | 1. HBM TC BONDER : TC BONDER 4.5 GRIFFIN / TC BONDER 4.0 TIGER / TC BONDER 1.0 GRIFFIN SB / TC BONDER 1.0 TIGER / HBM 6-SIDE INSPECTION 1.0 2. 2.5D TC BONDER : 2.5D TC BONDER 120 / 2.5D TC BONDER 40 C2S / 2.5D TC BONDER 40 C2W / BOC COB BONDER 3. FC BONDER : FC BONDER 3.5 / FC BONDER 3.0 / FC BONDER 5.0 / FC BONDER 75 4. VISION PLACEMENT : VISION PLACEMENT 6.0 GRIFFIN / VISION PLACEMENT 6.0D / VISION PLACEMENT 6.0L / VISION PLACEMENT 6.0T FAST / VISION PLACEMENT 8.0PS / VISION PLACEMENT 8.0UD / VISION PLACEMENT 8.0UL 5. micro SAW : micro SAW W1121a / micro SAW T2101 / micro SAW T1121 / micro SAW P2101 / micro SAW PL1121 / micro SAW PL1201 / micro SAW PL1241 / micro SAW GL2101 6. EMI SHIELD : 'EMI Shield 2.0 X' series for aerospace and Low Earth Orbit (LEO) satellite communications (EMI SHIELD VISION ATTACH 2.0 X / EMI SHIELD VISION DETACH 2.0 X / EMI SHIELD micro SAW & VISION PLACEMENT 2.0 X / EMI SHIELD TAPE MOUNTER 2.0 X / EMI SHIELD TAPE LASER CUTTING 2.0 X) 7. META GRINDER : META GRINDER 1.0 8. LASER : LASER ABLATION 5.0 / LASER MARK 3000S 9. OTHER : PICK & PLACE 2.0 / COVERLAY ATTACH 2000 / COVERLAY DETACH 2000 / STRIP MOUNT 2000 / 3D VISION INSPECTION 5.0 Founded in 1980, HANMI Semiconductor is a global semiconductor equipment company serving approximately 340 customers worldwide. We currently hold the No.1 global market share in the TC BONDER market for HBM, a core component of AI Semiconductors, and have also maintained the No.1 global position for 23 consecutive years in micro SAW & VISION PLACEMENT (mSVP), which are essential back-end semiconductor equipment. Headquartered in Incheon, South Korea, and operating a total of seven manufacturing plants, HANMI Semiconductor sustains its competitive edge through a fully vertically integrated manufacturing system that connects the enti?re value chain-from iron casting production, design, parts processing, software, assembly and inspection, through to distribution and sales. The product and service offering is as follows: 1. HBM TC BONDER : TC BONDER 4.5 GRIFFIN / TC BONDER 4.0 TIGER / TC BONDER 1.0 GRIFFIN SB / TC BONDER 1.0 TIGER / HBM 6-SIDE INSPECTION 1.0 2. 2.5D TC BONDER : 2.5D TC BONDER 120 / 2.5D TC BONDER 40 C2S / 2.5D TC BONDER 40 C2W / BOC COB BONDER 3. FC BONDER : FC BONDER 3.5 / FC BONDER 3.0 / FC BONDER 5.0 / FC BONDER 75 4. VISION PLACEMENT : VISION PLACEMENT 6.0 GRIFFIN / VISION PLACEMENT 6.0D / VISION PLACEMENT 6.0L / VISION PLACEMENT 6.0T FAST / VISION PLACEMENT 8.0PS / VISION PLACEMENT 8.0UD / VISION PLACEMENT 8.0UL 5. micro SAW : micro SAW W1121a / micro SAW T2101 / micro SAW T1121 / micro SAW P2101 / micro SAW PL1121 / micro SAW PL1201 / micro SAW PL1241 / micro SAW GL2101 6. EMI SHIELD : 'EMI Shield 2.0 X' series for aerospace and Low Earth Orbit (LEO) satellite communications (EMI SHIELD VISION ATTACH 2.0 X / EMI SHIELD VISION DETACH 2.0 X / EMI SHIELD micro SAW & VISION PLACEMENT 2.0 X / EMI SHIELD TAPE MOUNTER 2.0 X / EMI SHIELD TAPE LASER CUTTING 2.0 X) 7. META GRINDER : META GRINDER 1.0 8. LASER : LASER ABLATION 5.0 / LASER MARK 3000S 9. OTHER : PICK & PLACE 2.0 / COVERLAY ATTACH 2000 / COVERLAY DETACH 2000 / STRIP MOUNT 2000 / 3D VISION INSPECTION 5.0 |
| 회사소개 | AI 시대의 경쟁력은 반도체에서 시작됩니다. 그리고 AI 반도체를 가능하게 하는 핵심에는 반도체 장비 기술이 있습니다. AI의 폭발적 성장과 함께 HBM은 AI 반도체의 핵심으로 부상했습니다. HBM 제조의 가장 중요한 공정인 열압착 본딩(Thermo-Compression Bonding)에서 한미반도체는 세계 점유율 1위로 시장을 선도하고 있습니다. 1980년 설립된 한미반도체는 끊임없는 연구개발과 독자기술로 글로벌 반도체 어드밴스드 패키징 장비 시장을 이끌어 왔습니다. 연구개발부터 주물생산, 부품가공, 소프트웨어, 조립, 검사 그리고 유통과 판매까지 모든 가치 사슬을 연결한 ‘수직 통합 제조 (Vertical Integration)’를 통해 전 세계 340여 개 고객사의 신뢰를 받으며 차별화된 경쟁력을 제공하고 있습니다. 한미반도체는 2026년 HBM4용 ‘TC 본더 4.5 그리핀’, 고성능 메모리 생산을 위한 ‘BOC COB 본더’, AI 시스템반도체용 ‘FC 본더 3.5’, ‘2.5D TC 본더 40’, 우주항공과 저궤도 위성통신(LEO)을 위한 ‘EMI 쉴드 2.0 X’ 시리즈 등 총 5가지 신규 장비를 출시하며 AI 반도체와 차세대 첨단 패키징 시장을 선도할 기술 경쟁력을 더욱 강화했습니다. 한미반도체는 2026년 하반기 미국 현지 법인 ‘한미 USA’를 설립하며 본격적으로 미국 시장에 진출하는 전환점을 맞이하고자 합니다. AI 빅테크와 파운드리, 후공정(OSAT), 메모리 거점이 결집한 미국 AI 반도체 시장 역량 강화를 통해 공급망을 확장하겠습니다. AI 시대의 필수 인프라 기업으로서, 앞으로도 한미반도체는 ‘고객만족과 고객평등’을 최우선 가치에 두고, 차별화된 제품과 서비스를 제공하며 미래를 위한 지속적인 투자로 고객이 가장 필요로 하는 핵심 가치를 제공하는 기업이 되도록 노력하겠습니다. Competitiveness in the AI era begins with semiconductors. And at the very core enabling these AI semiconductors lies semiconductor equipment technology. With the explosive growth of AI, High Bandwidth Memory (HBM)has emerged as a crucial component of AI semiconductors. HANMI leads the global market, holding the No.1 market share in Thermo-Compression (TC) Bonding?the most critical process in HBM manufacturing. Founded in 1980, HANMI has led the global advanced packaging equipment market through relentless R&D and proprietary technologies. Through 'Vertical Integration' ?which connects the entire value chain from R&D, casting, and component processing to software, assembly, inspection, distribution, and sales?we provide differentiated competitiveness, earning the trust of over 340 customers worldwide. In 2026, HANMI will launch five new advanced tools, further strengthening its technological competitiveness to lead the AI semiconductor and next-generation advanced packaging markets: ● 'TC Bonder 4.5 Griffin' for HBM4 ● 'BOC COB Bonder' for high-performance memory production ● 'FC Bonder 3.5' for AI system semiconductors ● '2.5D TC Bonder 40' ● 'EMI Shield 2.0 X' series for aerospace and Low Earth Orbit (LEO) satellite communications In the second half of 2026, HANMI aims to mark a major turning point by establishing 'HANMI USA', its local U.S. subsidiary, to officially enter the American market. We will expand our supply chain by strengthening our presence in the U.S. AI semiconductor market, where AI Big Tech, foundries, Outsourced Semiconductor Assembly and Test (OSAT) providers, and memory hubs converge. As an essential infrastructure provider in the AI era, HANMI Semiconductor will continue to prioritize 'Customer Satisfaction and Customer Equality.' We remain committed to delivering differentiated products and services, investing continuously in the future to become a company that provides the core value our customers need most. |
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